

Attributes
Wireless Shell Test Bottom BoardModel Number
HeltecBrand Name
Modular designChipset
Indoor (industrial) applicationsApplication
LORA MODULEType
Sichuan, ChinaPlace of Origin
Supplier Type:Source factory
Interface Type:uart
Product Main Model:Wireless Shell Test Bottom Board
Interface:Micro USB
Battery Interface:SH1.25 x 2
Input Voltage:5V
Main Board Voltage:3V3
Temperature:-40~85℃
Dimension:38x52mm
Selling Units:Single item
Single package size:25X10X10 cm
Single gross weight:0.500 kg

















