Nơi xuất xứ
Guangdong, China
Cách sử dụng
Xây dựng, CMOS and other temperature sensitive devices are bonded
Phân loại
Chất kết dính khác
Product name
Low temperature epoxy adhesive
Characteristic
With any temperature and thermal treatment, matt excellent adhesion
Curing conditions
5-10min@80°C
Application
CMOS and other temperature sensitive devices are bonded